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The high peak power laser beam is focused on the surface of the brittle material by the flat field scanning objective lens under the moving reflection of the scanning galvanometer. The instantaneous heating is rapidly increased to the plasma gasification temperature, so that the material is gradually ablated by the laser and escapes from the surface of the material in the form of gas, thereby realizing the cut-through separation of the material.
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1. Product application
It is used in brittle materials such as sapphire & glass cover plate, optical glass, semiconductor package chip, sapphire & silicon wafer & ceramic substrate, thermally sensitive polymer & inorganic materials, micro drilling, cutting.
Second, performance indicators
◇ Cutting material: glass
◇ Glass thickness: ≦8mm
◇ Speed: 150mm/s
◇ Thermal influence: ≦10mm
◇ Edge collapse: ≦5um
◇ R angle cutting: ≦100um
◇ Consumables: none
◇ Cutting edge: no need for edging
Three, product advantages
◇ 1. Using picosecond or femtosecond laser, ultra-short pulse processing without heat conduction, suitable for high-speed cutting of any organic & inorganic materials
◇ 2. Using single laser dual optical path splitting technology, double laser head processing, the effect is doubled
◇ 3. CCD visual pre-scan & automatic target positioning, maximum processing range 750mm×550mm
◇ 4. Support a variety of visual positioning features, such as cross, solid circle, hollow circle, L-shaped right-angle edge, image feature points, etc.
◇ 5. Automatic cleaning, visual inspection and sorting, automatic up and down slope can be customized
◇ 6. 9 years laser micromachining system R&D and design technology accumulation, stable performance, no consumables
4. Sample display
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