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This equipment is an ultra-fast laser precision cutting machine developed for sapphire cutting in the 3C manufacturing industry. It is mainly used for cutting glass such as mobile phone sapphire HOME key, camera protection lens, etc. It is equipped with an ultra-fast laser, with high machining accuracy, small heat-affected area, no burrs and residues on the machining edge, and good long-term stability. Micromachining such as precision drilling, cutting, and grooving can also be performed on a wide variety of materials. Because it is equipped with double vibration lens, double station turntable and automatic loading and unloading device, it has a high degree of automation and high processing efficiency. Due to the dual-station structure, laser processing and automatic loading and unloading are performed simultaneously without interference.

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Product Features:

● High machining accuracy, small heat-affected area, and no burrs and residues on the machined edge

● Automatic loading and unloading, double station processing, high efficiency and stable performance

● Micromachining for precision drilling, cutting, and grooving of a variety of materials

● Non-contact processing, no need to replace consumables, low cost

Main application areas:Sapphire window cutting, fingerprint recognition glass cutting and others Cutting holes for brittle materials.